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Model B0922N7575AHF
Rev A
 Mounting Configuration:
 
 
In order for Xinger surface mount components to work optimally, the proper impedance transmission lines must be
used to connect to the RF ports. If this condition is not satisfied, insertion loss, Isolation and VSWR may not meet
published specifications.
 
All of the Xinger components are constructed from organic PTFE based composites which possess excellent
electrical and mechanical stability. Xinger components are compliant to a variety of ROHS and Green standards and
ready for Pb-free soldering processes. Pads are Gold plated with a Nickel barrier.
 
An example of the PCB footprint used in the testing of these parts is shown below. An example of a DC-biased
footprint is also shown below. In specific designs, the transmission line widths need to be adjusted to the unique
dielectric coefficients and thicknesses as well as varying pick and place equipment tolerances.
 
 
 
.50
3x .29
.50
Plated thru
hole to
ground
.33
.22
.22
3x Transmission
Line
3x .29
Dimensions are in Millimeters
Mounting Footprint
Solder Resist
Footprint Pad (s)
Circuit Pattern
 
 
 
相关PDF资料
BD0205F5050AHF XFRMR BALUN RF 70-1000MHZ 1608
BD0810J50100AHF XFRMR BALUN RF 800-1000MHZ 0805
BD0810J50200AHF XFRMR BALUN RF 800-2000MHZ 0805
BD0826J50200AHF XFRMR BALUN RF 800-2600MHZ 0805
BD1631J50100AHF XFRMR BALUN RF 1.6-3.1GHZ 0805
BD1722N5050AHF XFRMR BALUN RF 1700-2200MHZ 0404
BD2425N100ATI XFRMR BALUN RF 2400-2500MHZ 0404
BD2425N50100AHF XFRMR BALUN RF 2400-2500MHZ 0404
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